Facilities, Services and Trainings
Reference for quantum, micro and nano technologies
- Qualified personnel of INRiM, Politecnico di Torino e Università degli Studi di Torino;
- Design, fabrication, and characterization of quantum metrology devices;
- Growth, characterization, and processing of micro and nanoscale materials for the fabrication of MEMS, microsensors, and Lab-On-Chip.
Services
- Infrastructure access and training;
- Support to the development of new micro and nanostructured materials;
- Support to the measurement and characterization of devices for on-demand applications;
- Support for the design and development of functional devices and components.
Access mode
- Services provided by internal staff;
- Autonomous or assisted use.
Clean room access trainings
To access the PiQuET facility is mandatory to attend the access training.
INRiM, PoliTo, and UniTo personnel have to fill out the form to the right to pre-book their participation. Two weeks before the training date, the possibility of booking will be disabled. The PiQuET Staff will ask for your confirmation of participation before the training.
People who do not belong to INRiM, PoliTo, and UniTo, please send an e-mail to info@piquetlab.it.
Download the Access fees to services for the External users 2025
Clean room capabilities
1. Characterization of Quantum Devices
The functionality or principle of operation of Quantum Devices depends on quantum mechanical effects, which are physical phenomena occurring at atomic and subatomic scales.
Among quantum technologies, we deal with:
1. Quantum Clocks, which are extremely accurate and precise instruments that measure quantum
fluctuations of atoms;
2. Atomic Sensors, that provide RF-fields, temperature, length, gravity, space and geodetic reference;
3. Quantum Electronics, which deals with quantum electrical standards (based and the quantum Hall,
the Josephson, and the single-electron-transport effects), quantum-enhanced sensors (e.g. nano-
SQUIDS), and RF-based measurement methods and systems for future quantum computers;
4. Quantum Photonics, which investigates optical quantum phenomena at the single-/few-photon
level, such as coherence, entanglement and squeezing.
For these technologies, Quantum Metrology can provide (i) general traceability of quantum sensors, and
(ii) development of new physical and documentary standards by considering needs from stakeholders in
science and technology, industry, economy, and society.
1.1 Optical Cryostats
2. Deposition, Growth & Thermal Treatment
Deposition and Growth refer to different technologies which permit growth or transfer of thin films on a
substrate.
The selection of the desired deposition technique depends on material deposited, desired film
characteristics (thickness, density, grain size, mechanical and/or optical properties), substrate temperature
tolerance, and on the characteristic of the growth material (amorphous, polycrystalline, or crystalline).
Thermal treatment refers to technologies that permit to dope or oxide the growth film or the substrate,
or change their mechanical properties by heating.
2.1 Atomic Layer Deposition (ALD)
2.2 Low-Pressure Chemical Vapour Deposition (LPCVD)
2.3 Inductively Coupled Plasma – Chemical Vapour Deposition (ICP-CVD)
2.4 Sputtering Kenosistec
2.5 Hot embossing
2.6 Rapid Thermal Processing
2.7 Parylene coater
2.8 Graphene Chemical Vapour Deposition
2.9 E-gun Evaporator
2.10 E-Beam Telemark
3. Lithography
Lithography is a family of methodologies of transferring a two-dimensional pattern to a wafer substrate.
The patterning is achieved through one of two base methods:
- directly writing the pattern (laser writer or EBL), or
- transferring the pattern through a mask/stamp (optical lithography).
The defined pattern can help
to define features on the substrate (e.g. etching) or the features can be formed by the deposited pattern.
3.1 Laser Writer
3.2 UV LED exposure system
3.3 Double side Mask aligner
3.4 Nano Rapid Prototyping System (2PP)
3.5 Electron-Beam lithography (EBL)
4. Etching
Etching refers to any mechanism that removes material from the wafer substrate or from the surface of
the sample.
5. Chemical processing
Chemical processing refers to cleaning process and pre-treatment of wafers, wet chemical processing
for the deposition and developing of the lithography materials, patterning, wet etching.
5.1 Chemical Mechanical Polishing (CMP)
5.2 Chemical hoods (General, Full lithographic benches)
6. Packaging
Packaging describes many different technologies used to separate the devices from the wafer (dicing),
isolate the devices, make electrical connections to the device (bonding), and incapsulate the final device.
6.2 Wire Bonder Wedge/Ball Bonder
6.3 Wafer Bonder
6.4 Wafer Dicer
6.5 Hot Embossing
7. Characterisation
Characterisation techniques refers to all instruments that permit to study the fabricated device, in
particular:
- Surface Topography (roughness, texture) and Physical Dimensions (height, width, pitch, etc.);
- Material Composition (elemental composition);
- Material Physical Properties (e.g. optical, electrical, piezoelectric, magnetic properties).
7.1 Electron Microscopes
- Tabletop SEM
- Scanning Electron Microscope/Focused Ion Beam (SEM/FIB)
- Transmission Electron Microscopy (TEM)
7.2 Probe station
7.3 Atomic Force Microscope (AFM)
7.4 Digital microscope
7.5 Ellipsometer
7.6 Stylus profilometer
Additive Manufacturing Laboratory