Description

The Disco DAD 3221 is a dicing machine, capable of cutting wafers and samples as thick as 2mm. It can handle silicon, glass, sapphire and most other hard materials. Its motorised stage X-Y control allows very precise positioning of the blade over pre-existing structures; a fine control over Z allows complete or partial cut into the specimen. An automatic pattern recognition routine also allows automatic dicing of large wafers with arbitrary markers.

Technical specification

• up to 6” wafers
• various blade widths, depending of specimen material and application, from 50 to 250 microns
• dicing speed up to 10 mm/s
• full automation and programmable positioning of cut lines