Description

The TPT Bonder utilises the basic ultrasonic bonding method. Bonding two types of metals using the ultrasonic method results from three variables: force, ultrasonic power and time. If the HB16 is used for gold wire bonding, heat is used as a fourth variable. At this point these parameters will be explained briefly. 

The force supports the plastic deformation and facilitates the coupling between the bonding tool, the wire and the substrate.

The scrubbing effect of Ultrasonic (63,3kHz) displaces the contaminants on the surface and ensures metal to metal coupling. When using the Ballbond or Ball Bump option, altering the Ultrasonic also changes the size of the ball.

The time has to be set sufficiently long to cause solid state diffusion.

The heat supports the ultrasonic. With more heat is less ultrasonic necessary.

Ultrasonic Bonding is a type of friction based welding, but it is not a process which uses high temperatures to fuse 2 metals. To connect the wire with the substrate, it is pressed onto the surface, while being moved laterally according to the settings of the ultrasonic, as shown in the illustrations below. If heat is used as a fourth variable the process is called Thermosonic Bonding

Technical specification

• The HB16 ultrasonic wire bonder is characterized by vertical feed of wire or ribbon, with motorized control of the Z & Y Axis.
• The machine can be used with Gold and Aluminum wires and is equipped with:
  • Capillary: used to perform Ballbonds and Ball Bumps
  • Wedge Tool: used to perform Wedgebonds with the second hole at 45°.
  • The maximum temperature of the heated substrate holder is 250°C.