Description

The FINEPLACER® lambda 2 is a die bonder with sub-micron placement accuracy for fine pitch devices, for example:

• flip chips and flip chip assemblies
• optoelectronic components
• micro electro mechanic systems (MEMS)
• micro optoelectronic mechanic systems (MOEMS)
• sensors
• micro optics
• TAB
• bare chips
• high-count surface mounted devices (SMD)

The FINEPLACER® system is based on a unique placement principle. Using the highly accurate Vision Alignment System (VAS), the FINEPLACER® lambda 2 accurately places the component on the first attempt. With its accuracy of 0.5 μm, it is possible to position new technology components with very fine pitch uniformly and accurately.

Technical specification

You can perform all state-of-the-art bonding technologies, such as:

• Sintering
• Thermocompression bonding
• Soldering/eutectic soldering
• Adhesive bonding

with the following specifications:

• Accuracy: 0.5 μm
• Component: Min: 0.03 mm x 0.03 mm; Max: 20 mm x 20 mm
• Substrate: 150 mm x 150 mm
• Force: from 0.1 N to 400 N