Description

The AML-AWB aligner wafer bonder platform can perform in-situ aligned bonding using the following bonding methods: anodic, glass frit, adhesive, thermo-compression, eutectic, solder and direct (low T “RAD” activated).

Equipment name and Company: AWB04 AML

Technical specification

• 4 and 6 inches tungsten upper and lower platens for all bondings except anodic
• 4 and 6 inches graphite upper platens for anodic bonding
• Water wapor RAD system for surface activation prior to direct bonding
• in-situ alignement (both visible and IR cameras available)
• Pressure control system (to insert a process gas of choice, up to 2 bar) available