Double side Mask aligner

Description

The NXQ4006 Mask Aligner combines innovative design with precision alignment and exposure features. The versatility of the NXQ4006 makes it an ideal tool for basic photolithography and for R&D Work on small pieces and Odd Sized Substrates

It allows Soft/Hard pressure contact and Vacuum contact printing. The system can also print in Manual Proximity mode after leveling between the wafer and mask. It can process partial and whole substrates up to 150 mm (6”). Ideal fo manufacturing and R&D activities, for a wide range of technologies.

With two VIS-light objectives for top-view observations and two IR-light objectives for bottom-view / though-the-wafer observation, the tool allows multiple lithographies to be carried out with proper alignement on the sample, both on the top side and on the bottom side of the wafer (i.e. for MEMS applications)

 Equipment name and Company: NXQ4006 / Neutronix Quintel

Technical specification

  • Maximum Substrate Size ‐ 6ʺ Diameter; configurable from small dies up to 6ʺ wafers with pooling options
  • NXQ VideoView Splitfield Microscope
  • Two High-definition color Cameras and dual HD Monitors
  • 5x Offset Objective Pair
  • LED through-objective illumination
  • Infinity Corrected Lens for Excellent D.O.F. and Resolution
  • Singlefield / Splitfield Viewing
  • Motorized z-axis Focus
  • Printing modes: Hard and soft pressure contact, Vacuum contact and manual proximity print modes

 

  • Manual Tray Load for Substrate Load/Unloading
    – Manual Prealigner ‐ for Repeatable Placement
  • Semi Automatic Loading Feature
    – Automatically Clamps and Releases wafer during Load / Unload
  • Automatic Wafer Planarization (WEC)
    Automatically Moves to Align Gap After WEC
    – Automatically Performs Wedge Error Compensation
  • Optical Backside Microscopes and IR BSA (OBS and IR BSA)
    – 5x Objectives
    – High definition color Cameras with up to 320x Magnification
    – Integrated OBS and IR ‐ Thru Object Illumination
    – Computer-assisted Image Overlay / Processing
  • UV Exposure Optics ‐ 350 / 500 Watts
    – Standard / Broadband Exposure Optics (350nm‐450nm), with possibility of adding a filter to select a narrow wavelength band
    – High Resolution, Low Diffraction Optics with Integration and Collimation for Improved Print Resolution
  • Integrated Vibration Isolation Table